Causes and countermeasures of solder defects in LED flexible light strips

The use of solder paste in the production process of LED flexible strips is a key to product quality. LEDER Lighting will now share some of its practical experience with you, hoping to help friends.

LEDER Lighting is a manufacturer that mainly produces LED flexible light strips, LED line lights, and LED panel lights. It mainly uses 2835 light strips, 5050 light strips, 3528 light strips and other LED flexible light strips. Quality assurance, quality first!

Causes and countermeasures of solder defects in LED flexible light strips:
1. It is best not to store the solder paste in the refrigerator for more than one month.
2. After the solder paste is opened, it is best to use it up within one day, and the solder paste beyond the time limit must not be used. Solder paste scraped back from the stencil should also be sealed and refrigerated.
3. The solder paste should be thawed for more than four hours before use and then stirred. It should be stirred for at least 5 minutes with a blender or by hand.
4. When the solder paste is placed on the stencil, try to put the amount of solder paste used, not too much, just put enough grams, if you put too much solder paste or use it for too long, there will be weak soldering, poor soldering, etc. Phenomenon.
5. Add new solder paste to the stencil every hour.
6. The circuit board on the stencil should be furnaced within half an hour. It should not be left for too long without being furnaced, otherwise it will be oxidized.
7. The solder joint process must be adjusted according to the furnace temperature table of the solder paste.
8. The solder joints with BI solder paste are the most fragile, and they will fall off when subjected to a certain thrust. If the circuit board can withstand high temperature, it is best not to choose BI non-sugar solder paste.
9. The copper oxidation standard on the circuit board soldering board is related to the use of solder paste. If the copper oxidation standard is set, it will affect the oxidation speed of the solder paste.